7.1.3 Solder Joint Acceptance Criteria
pcb design - IPC Specification for pad width vs. pin width (SMD) - Electrical Engineering Stack Exchange
IPC J-STD-001 Standard for Soldering | Sierra Circuits
THROUGH-HOLE SOLDERING GENERAL REQUIREMENTS
Reliable filling of the barrels
The Basics of Soldering — Part 2 | Servo Magazine
IPC-2221 & 2222 and Through-hole Pad Stacks - PCB Libraries Forum
Criteria for PCB Assembly - PCB Assembly Standard | Viasion
RoHS-Compliant Through-Hole VI Chip® Soldering Recommendations
Understanding IPC Class 2 vs Class 3 for a Gull Wing Lead - The Samtec Blog
Device Connection Integration in the SMT Process
Pin-in-Paste technology, the cheapest way to solder THT components
Acceptable Plated Through-Hole Fill Ratio in IPC Standards
Device Connection Integration in the SMT Process
IPC 7351: Explaining the Standard for PCB Footprints - Free Online PCB CAD Library
Device Connection Integration in the SMT Process
pcb - PTH drill diameter do the IPC take the pin distance in account? - Electrical Engineering Stack Exchange
How to calculate PTH hole and pad diameter sizes according to IPC-7251, IPC-2222 and IPC-2221 standards? - PCB 3D
ANP078: WE-RJ45 LAN for Through-Hole Reflow - element14 Community
pin_protrusion_2_320240.jpg
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
7.1.3 Solder Joint Acceptance Criteria
The IPC-7351 Specification Explained: SOIC Components – SnapMagic Blog
THROUGH-HOLE SOLDERING GENERAL REQUIREMENTS
WE-RJ45 LAN for Through-Hole Reflow
IPC J-STD-001 Standard for Soldering | Sierra Circuits
Best Practices in Manufacturing: Wave Soldering - VEXOS
Wave soldering successfully replaced
